Tseng Vincent的部落格

Vistec Semiconductor Systems GmbH, showcases LDS3300 C with a newly added state of the art solution for wafer edge and backside defect detection. The “parallel processing” allows 100 percent wafer front side inspection at the same time. A flexible system layout and the integrated software capabilities enable a perfect integration into the 300mm fab automation process. The unique system modularity as well as the high throughput ensure excellent efficiency, increased overall fab yield and reduced cost of ownership.